VISE –i.MX6QuadPoP Development Board by Mistral Solutions

Document created by edk Employee on Feb 4, 2015Last modified by Diana Torres on Apr 18, 2017
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Features

i.MX 6 Dual/Quad Package on Packing (PoP)

  • Small 12 x 12 mm Package on Package (PoP) enables small form-factor designs for mobile products
  • Simplification of PCB design by eliminating layout high-speed DDR interfaces
  • CPU: i.MX 6 Dual/Quad ARM® Cortex®-A9 SoC @ 1.2 MHz
  • Memory: Micron 4 GB Mobile LPDDR2 (PoP) SDRAM
  • 60x 40 mm system-on-module (SOM), plugs into carrier module, dual board architecture
  • SOM contains 1.2 GHz i.MX 6PoP Dual/Quad, LP-DDR2 (PoP), Wi-Fi® & BT® 4.0 (BTLE)
  • Carrier board contains 9-axis sensor, additional interfaces (display, camera, audio) and connectivity (USB, GigE.)
  • Yocto Linux and Android™ KitKat support
  • Compact and light weight, industrial and commercial grades
  • Includes i.MX security features

 


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